FLEXILVIA
(Flex Inlays in Large Volume for Identification Applications)

The main goal of the project is to develop flexible RFID inlays and associated reel-to-reel processes compatible with a high volume production. The RFID inlays are made of flexible substrates on which small silicon chips are assembled by flip-chip.

This project aims at designing, manufacturing and packaging flexible antennae to be used in contactless object identification and tracking systems exploiting radio frequency identification technologies.

The FLEXILVIA project is intended to have a significant impact in pushing the expansion of RFID applications and the technology step of the replacement of traditional logistic barcodes by electronic tags in a few years to come.

The FLEXILVIA project is a combination of radio waves-based technology and microchip technology and will therefore assemble small silicon processors on antennae substrates that will be integrated into labels for use. The goal of the project is to find the proper reel-to-reel mass production processes suitable in making antennae on flexible substrates and assembling the chips on them with both increased yield, throughput, reliability and high volume while being low cost. The main technology blocks adressed by the project include the antennea substrates, the chip bonding, the inlay conversion and the testing, covered by the project partners: FCI, Meco, Datacon, AT4 wireless and Paragon Identification.

Time schedule:
Start: July 2007
End:  July 2009