Besi is a leading manufacturer of semiconductor packaging, plating and die handling equipment for both leadframe and array connect applications. We design and manufacture technologically-advanced, high-performance equipment for the semiconductor industry's assembly process operations.

Our equipment is used principally to produce semiconductor packages, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. Our innovative systems offer customers high productivity and improved yields of defect-free devices at low total cost of ownership.  We operate primarily through wholly owned divisions.